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Type: 
Journal
Description: 
The dielectric degradation of ultrathin (∼2nm) silicon dioxide (SiO2) layers has been investigated by constant and ramped voltage stresses with the conductive atomic force microscopy (CAFM). CAFM imaging shows clearly the lateral degradation propagation and its saturation. Current-voltage characteristics, performed at nanometer scale, show the trap creation rate in function of the stress condition. The critical trap density has been found.
Publisher: 
American Institute of Physics
Publication date: 
29 May 2006
Authors: 

Patrick Fiorenza, Wouter Polspoel, Wilfried Vandervorst

Biblio References: 
Volume: 88 Issue: 22 Pages: 222104
Origin: 
Applied physics letters