The use of SiC technology to face the automotive challenges in the coming years is among the objectives pursued in the ECSEL JU project WInSiC4AP. The project is supported with a synergy between ECSEL JU and ESI financing that will enable complementary activities with significant economic and social impact. The Project led by DTSMNS (Distretto Tecnologico Sicilia Micro e Nano Sistemi) started on June 2017 for a duration of 36 months on research, technology, package and applications. This paper will address the main activities in 2 nd year of project for automotive with a focus on innovations in SiC technology and the power module packaging.
2 Jul 2019
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE)