In below, reference 1 is incorrect. It should read: A. Sitta, M. Calabretta, M. Renna, and D. Cavallaro, “Solder joint reliability: Thermo-mechanical analysis on power flat packages” in Advances on Mechanics, Design Engineering and Manufacturing . Cham, Switzerland: Springer, 2017, pp. 709–716.
18 Dec 2019
Volume: 19 Issue: 4 Pages: 796-796
IEEE Transactions on Device and Materials Reliability