Edited by:

Filippo Giannazzo (CNR-IMM, Catania, Italy)

Samuel Lara Avila (Chalmers University of Technology, Sweden),

Jens Eriksson (Linkoping University, Sweden)

Sushant Sonde (The University of Chicago, USA)

Editorial Office, MDPI, St. Alban-Anlage 66 4052 Basel, Switzerland

ISBN 978-3-03897-607-3

Abstract

Two-dimensional (2D) materials and their vertical/lateral heterostructures are currently the subject of massive research interests, both for fundamental science and for technological applications in diverse fields, such as electronics, optoelectronics, quantum metrology, spintronics, membranes, energy conversion/storage, and sensing. Integration of 2D materials within real device structures currently represents the main challenge to move from the laboratory stage to industrial applications, especially in the fields of electronics/optoelectronics.

This Book is a collection of 9 papers, covering the different key topics of this rapidly developing research field. These include: synthesis of 2D materials, progress in relevant processing issues (contact, doping and mobility engineering), advanced characterization techniques, novel device applications based on the integration of these 2D materials.

Many of the papers of this collection are review papers, providing the general introductory information and a broad overview of the most recent advances in the specific topic. Hence, this book can serve both as a general introduction for non-experts in the field and as a guide for scientists/engineers working in the field of 2D materials integration.

Articles in this book are Open Access and distributed under the Creative Commons Attribution (CC BY) license, which allows users to download, copy and build upon published articles, as long as the author and publisher are properly credited, which ensures maximum dissemination and a wider impact of our publications. The book as a whole is distributed by MDPI under the terms and conditions of the Creative Commons license CC BY-NC-ND.

Downdload from the link:      https://www.mdpi.com/books/pdfview/book/1137