Transfer molded modules (TMMs) are becoming more and more diffused in semiconductor industries for several automotive applications. Epoxy molding compounds are used as plastic encapsulants for TMMs thanks to their adhesion, hygroscopic ruggedness and reliability improvement in active cycle conditions. However, a numeric quantification of adhesion is of paramount importance to build up a methodology to compare different resins. The target of the activity is the characterization of the adhesion strength and mode-mixity angle for copper-resin system. Four point bending experiment and numeric model based on fracture mechanics are employed for this purpose.