Thermal annealing plays a crucial role for healing the defectiveness in the ion implanted regions of DIMOSFETs (Double Implanted MOSFETs) devices. In this work, we have studied the effect of a double step annealing on the body (Al implanted) and the source (P implanted) regions of such devices. We found that a high temperature annealing (1750 C, 1h) followed by a lower temperature one (1500 C, 4h) is mandatory to achieve low defects concentration and good crystal quality in both the n-and p-type zones of the device.