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Type: 
Conference
Description: 
The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted
Publisher: 
IEEE
Publication date: 
5 Jul 2020
Authors: 

Alessandro Sitta, Marco Renna, Angelo Alberto Messina, Gaetano Sequenzia, Giuseppe D’Arrigo, Michele Calabretta

Biblio References: 
Pages: 1-3
Origin: 
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)