Antonio Landi, Aye Aye Mon, Laura Liaci, Alessandro Sitta, Michele Calabretta, Antonella Sciuto, Giuseppe D’Arrigo, Marco Renna, Vincenzo Vinciguerra
Biblio references: Pages: 1-6
Origin: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)